{"id":5135,"date":"2023-11-03T20:12:20","date_gmt":"2023-11-03T11:12:20","guid":{"rendered":"https:\/\/eng-lab.co.jp\/en\/?page_id=5135"},"modified":"2024-03-20T18:37:50","modified_gmt":"2024-03-20T09:37:50","slug":"400-daibon-3","status":"publish","type":"page","link":"https:\/\/eng-lab.co.jp\/en\/case\/semicon\/400-daibon-3\/","title":{"rendered":"Dispensing to wafers"},"content":{"rendered":"\n
<\/span>
\n

Dispensing to wafers<\/strong><\/h2>\n\n\n\n
\n
\n

Our product can coat (paint out) the entire surface of a wafer with a liquid agent such as polyimide or high-viscosity resist. Because it can dispense the required amount to the target position, the amount of the used material can be reduced significantly by comparing with a spin coater. It also dispenses to the circumference of a wafer.<\/p>\n\n\n\n

It can dispense to dies, so that it is best suited to the dispensing process of manufacturing of parts such as power devices, MEMS and miniature electronic parts.<\/p>\n\n\n\n

Applicable product: Twin-air<\/strong><\/p>\n\n\n\n

 <\/strong><\/p>\n<\/div>\n\n\n\n

\n
\"\"<\/figure><\/div>\n\n\n

Dispensing machines for wafers<\/p>\n<\/div>\n<\/div>\n\n\n\n

\n
\n
\n